AMAT

2 claims

• host 18:40
  ASML is reportedly developing a hybrid bonding tool; a host says Besi and Applied Materials each took about 10 years to mature theirs.
  ASMLBESIAMAT novelty 2/3 · verifiable 2/3
  The Circuit · WFE to the Moon (Still), Semicon West and OCP Insights · 2026-10-19 · 2026-10-17-weekly
• host 19:54
  Applied Materials is bullish on hybrid-bonding HBM wafers to stack higher, contrary to HBM buyers at Hot Chips who asked not to stack higher; Applied said it depends on workload.
  AMAT novelty 2/3 · verifiable 2/3
  The Circuit · WFE to the Moon (Still), Semicon West and OCP Insights · 2026-10-19 · 2026-10-17-weekly