BESI

• Per patent filings, ASML is building a not-yet-announced die-to-wafer hybrid bonding tool.

  host (Jordan Nanos)0:43ASMLBESI
  SemiAnalysis · Ep. 040 - ASML Is Building a Hybrid Bonding Tool, and Its Patents Show How (AI Supply Chain) | Jordan Nanos, Howie, Sherry Zhang · Oct 23, 2026 · Issue

• ASML is reportedly developing a hybrid bonding tool; a host says Besi and Applied Materials each took about 10 years to mature theirs.

  host18:40ASMLBESIAMAT
  The Circuit · WFE to the Moon (Still), Semicon West and OCP Insights · Oct 19, 2026 · Issue