Per patent filings, ASML is building a not-yet-announced die-to-wafer hybrid bonding tool.
SemiAnalysis analyst (Howie or Sherry Zhang)
25:53High-NA EUV's half-size reticle limits die size to about 400 mm2 versus about 850 mm2 today; a 6x12 mask would restore the full size.
ASML novelty 1/3 · verifiable 3/3 SemiAnalysis analyst (Howie or Sherry Zhang)
27:51ASML management said on its recent earnings call that pricing is value based, so higher tool throughput raises prices.
ASML novelty 1/3 · verifiable 3/3 guest (Chris Auth, Intel process development)
15:04Intel's process lead says backside power lets 14A use High-NA EUV in a single pass, while TSMC without backside power would still need double-patterned EUV.
ASML is reportedly developing a hybrid bonding tool; a host says Besi and Applied Materials each took about 10 years to mature theirs.
A host says a person he spoke to had received tool orders from Terafab, Musk's planned fab, the first tangible sign of activity.
TerafabASML novelty 2/3 · verifiable 1/3