guest (Intel CTO Pushkar Ranade)
50:40Intel's CTO says that with the world's existing chipmaking tools leading-edge wafer output could roughly double but not rise tenfold.
INTC novelty 3/3 · verifiable 1/3 guest (Intel CTO Pushkar Ranade)
1:08:47Intel's CTO says that, knowing today's demand, Intel would have invested more a year ago and will now invest more.
INTC novelty 2/3 · verifiable 2/3 guest (Chris Auth, Intel process development)
15:04Intel's process lead says backside power lets 14A use High-NA EUV in a single pass, while TSMC without backside power would still need double-patterned EUV.
guest (Intel CTO Pushkar Ranade)
1:01:52Intel says it is working with Elon Musk's Terafab to help accelerate bring-up of Musk's own fab.
INTCTerafab novelty 2/3 · verifiable 2/3 guest (Intel CTO Pushkar Ranade)
56:08Intel's CTO says Intel is already within a few percent of TSMC on performance, power or density and that the remaining gap is wafer scale.
INTCTSM novelty 1/3 · verifiable 2/3 Intel has shared its process flow and tool list with Terafab, according to people the host spoke to.
INTCTerafab novelty 3/3 · verifiable 1/3 Tesla and SpaceX have recruited heavily from Intel, including its fab manager, and from Samsung's Taylor, Texas fab, offering roughly 1.5 to 2 times prior market pay (as stated).